Technology

MEMS stands for Micro-Electro-Mechanical Systems. The Piezo MEMS Silicon Solutions leverage the inverse piezoelectric effect, where an input voltage causes piezo MEMS materials to contract or expand, transforming electrical energy into mechanical energy. This mechanical energy drives an integrated membrane, producing airflow and pressure essential for sound generation. This approach enables more precise, reliable, and energy-efficient audio and sensing solutions, marking a new frontier for next-generation acoustic products. Key applications of MEMS acoustic products include wearable devices, medical instruments, and consumer electronics.

Our advantages

 

high efficiency

MEMS acoustic units use lateral strain to produce audio directly from the diaphragm, offering significantly higher efficiency compared to traditional dynamic and balanced armature speakers.

Small Size

MEMS units are typically in the millimeter range, allowing flexible assembly and configuration while providing ample space for other components.

Wide Frequency Range

MEMS units cover a frequency response from Hz to MHz, delivering superior high-frequency sound quality.

High Integration

MEMS acoustic modules can be integrated with electronic components on a PCB, including wireless earbuds, headphones, wearables, hearing aids, and ultrasonic devices, streamlining structural design.

High Sensitivity

MEMS acoustic chips enhance sound pressure levels, ensuring high-sensitivity imaging.

High Directivity

With directivity up to +/-1 bias, MEMS units minimize crosstalk and deliver an immersive experience.

High Consistency

Silicon-based semiconductor processes ensure precise production control, resulting in low device-to-device variation.

Low Cost

The mature semiconductor manufacturing processes and cost control models enable extremely low costs with large-scale production.